SMD Sicherungen für Oberflächenmontage

No.066/0603　

Produktserie:SMD Sicherungen für Oberflächenmontage

Mainly used in handheld electronics, LCD monitors, battery packs, hard drives, servers, computers, scanners and printers, data modems,

game consoles, car chargers, digital cameras, DVD players, notebooks, DC-DC converters, etc

Main Characteristics：Chip fuse; Time-Lag (T)
Standard：UL248-14
Approval：cURus

Materials
Substrate: Ceramic
Termination: Silver over-plated with nickel and tin
Operating Temperature：-55℃ to +150℃

Storage Conditions：+10℃ to +60℃
Relative humidity:≤75% yearly average
Without dew, maximum 30 days at 95%

Soldering Parameters
260℃.≤10 sec (Wave Soldering)
350℃.≤3 sec (Hand Soldering)
Soldering Peak:
260℃. 10 sec.
280℃. 5 sec.